Die Bonding

Custom Interconnect Limited offers a complete semiconductor packaging solution. We provide bonding of bare die using conductive and non-conductive die attach materials, eutectic solders and silver sintering techniques. Our facilities have the capacity for every order size – from orders quantities of  several hundred thousand to single die and batches of one. We have five fully automatic die placement machines -  three of which are high accuracy machines for larger die and more complex component handling.  If you’re looking for die bonding, get in touch with our helpful sales team today.

Die Attach Capabilities

Our bare die placement capability is second to none:

• Variety of die types available - We have extensive experience in product development and production quantities of 
• IGBT
• SiC
• GaN
• ASIC
• MEMS
• LED
• Laser
• Detectors and large area die (150mm x 175mm)
• Medical & Biosensors
• All commercially available die types

• Die Attach method - A range of conductive and non-conductive epoxies to suit customer technology

                                               Wafer backed conductive epoxy

                                               Eutectic soldering with vacuum assist and formic acid atmosphere for flux-less soldering and very low voiding IGBT / SiC

                                               Silver Sintering, high, low and pressureless sintering for SiC & GaN die attach

• Positional accuracy – currently our positional accuracy is achieving better than 10 microns in both X & Y, and a theta accuracy of better than 1.0 degree.

• Placement accuracy - Using our Non-Contact Coordinate Measurement station, we can verify placement accuracy to a resolution of better than 1/10 of a micron.
• Range of die sizes - Die sizes processed can vary from 0.3mm x 0.3mm up to 150.0mm x 175.0mm and can be of any semiconductor material.
• In house testing - As new or revised materials and structures become available we are able to conduct controlled Shear Testing in-house using our Dage Die Shear & Wire Pull Test Station. This is further backed up by in-house X-Ray / CT Scan / CSAM inspection methods. This ensures that appropriate standards for die attach and its shear strength are met. 

We also have on site multiple N2 storage cabinets for the long term storage of wafers / die. This enables us to bond die to a variety of substrates which include:

• FR4 Laminate COB
• Flex-rigids
• Alumina or other Metallised ceramics.
• DBC / AMB / AiN substrates
• Ceramic packages and lidding for component obsolescence and high temperature requirements
• Carbon Fibre and Steel.
• Aluminium Backed & Aluminium
• Thick Film & Thin Film.
• Polyimide rigid and flexible circuits.
• RT / DUROID / RO4350B circuits up to 80GHz 

As part of a Product Technical Review, we can provide our customers with design proposals detailing appropriate substrates. Additionally, we’ll be able to advise on the choice of materials and finishes. Our Project Management and Engineering Team have the requisite experience and knowledge to help and assist you with this process.

When you consider that CIL compliments this with Automatic Wire Bonding and our extensive SMT & test capabilities, CIL can offer a total product solution.

Get in touch with our Business Development team, and arrange a visit to meet the CIL Advanced Technology Group in order to explore applications and manufacturing methods available.