CIL’s BP2 Semiconductor Packaging facility accredited to ISO9001:2015, AS9100D and ISO13485:2016 12 months after opening

As part of its on-going commitment to quality, in addition to its existing Andover based CIL House and Rennie Gate facilities, CIL has now extended all three quality accreditations to its BP2 Semiconductor Packaging facility. The full audit for ISO9001:2015, AS9100D and ISO13485:2016 is a biennial event with surveillance audits every 12 months, and during the recent full audit, BP2 was successfully added to the scope of all three audits in the first year after opening.

This achievement is a testament to the hard work and dedication of our entire team and CIL are looking forward to many more years of working in these industries

The certifications were awarded as CIL concluded its current financial year at the end of June 2024 with sales up 17% over the previous year and up 68% over the last 2 years. With turnover now exceeding £31.0M/annum, CIL’s growth was slowed slightly in the last 12 months as it concentrated on the roll out of its BP Semiconductor Packaging facility, but now that it is open and fully operational, CIL now has the space to grow significantly.

CIL is unique in the UK being able to offer

• SiC Power module design and manufacture up to 1000A / 1000V
• GaN Power module design and manufacture
• Microelectronic package design and manufacture
• Wafer dicing
• Die bonding
• Sintering
• Wire bonding
• WLCSP and interposers
• Encapsulation including glob top, selective glob top, overmold and open cavity overmold
• Device Test
• PCBA Prototyping
• Small to medium volume PCBA Assembly and test
• Volume PCBA Assembly and test
• X-Ray, CT Scan, CSAM and CMM inspection and measurement all in-house
• Box build of complete product

Attainment of the latest ISO9001:2015, AS9100D and ISO13485:2016 revision’s display an on-going commitment by CIL to provide exceptional service to its customers in a diverse range of industries. It also gives the UK a strong footprint of high technology design and manufacturing capability in complex electronics, microelectronics and power devices using both SiC and GaN semiconductors.