The use of X-Ray within electronics manufacture has largely been associated with the Inspection of BGA's, however at Custom Interconnect Limited our Dage XD7600 Digital X-Ray system is also used for many other things. With many components using Thermal Pads and integrated heat-sinks, the importance of void free soldering and ensuring that these devices are correctly soldered is of uptmost importance. High degrees of voiding means thermal predictions may be badly affected, and thereby affecting product reliability.
Components with hidden or BGA style joints are inspected using X-ray, as part of the in-process verification for NPI and Engineering assessments. The XD7600 system is very versatile and produces instant image capture and, if required, video footage of the assessment. The system is able to measure attributes and calculate aspects such as Void Percentages within a joint are; track & gap measurements; as well as the land and pad dimensions, including areas for calculating joint to pad ratios.
We also use X-ray within our Anti-Counterfeiting Procedures as a non-destructive assessment of supplied goods. This is used to verify uniformity of supply and to view and investigate anomalies, please feel free to view our section relating to Anti-Counterfeiting procedures and practices.
X-Ray Assessments are available as a stand-alone service, talk to our Business Development team for advice on a practical and cost effective course of action.