Wafer Dicing

Wafer Dicing / Sawing is the process of singulating the wafer into individual die ready for subsequent assembly or sorting into waffle / GEL packs.

CIL has the capability for Wafer saw of substrates up to 300mm diameter using its DISCO 3361 Semi-automatic dicing system. CIL's DISCO 3361 system has been installed with all of the water treatment and purification sub-systems to support multiple wafer types such as Silicon (Si), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Glass and Ceramics.

The wafer dicing equipment is all housed within CIL's ISO7 Semiconductor packaging facility and utilises specialist LED lighting for the control of UV sensitive processes.

Get in contact with a member of our friendly sales team for more information on our wire bonding capabilities today.

Why work with CIL?

As part of a Product Technical Review, we can assist our customers by providing you with design proposals detailing appropriate substrates; advise on the choice of materials and finishes; wire sizes and types. Our Project Management and Engineering Team have the requisite experience and knowledge to help and assist you with this process.

Furthermore, when combined with our die bonding and extensive SMT & test capabilities, CIL can offer a total product solution.

Get in contact with a member of our friendly sales team for more information on our wire bonding capabilities today.